Bob Moore 9e41d93c97 ACPICA: Fixed a memory leak when Device or Thermal objects referenced in packages ... Problem introduced in fix for Package references. Signed-off-by: Bob Moore <robert.moore@intel.com> Signed-off-by: Alexey Starikovskiy <astarikovskiy@suse.de> Signed-off-by: Len Brown <len.brown@intel.com>		2008-04-22 14:29:26 -04:00
..
Makefile
utalloc.c	ACPICA: Lindent	2007-05-09 23:34:35 -04:00
utcache.c	ACPICA: Lindent	2007-05-09 23:34:35 -04:00
utcopy.c	ACPICA: Support for external package objects as method arguments	2007-06-02 00:20:29 -04:00
utdebug.c	ACPICA: Fix for fault if Load() fails	2008-04-22 14:29:24 -04:00
utdelete.c	ACPICA: Fixed a memory leak when Device or Thermal objects referenced in packages	2008-04-22 14:29:26 -04:00
uteval.c	ACPI: autoload modules - ACPICA modifications	2007-07-23 13:56:00 -04:00
utglobal.c	ACPICA: New interfaces for table event handlers	2008-04-22 14:29:24 -04:00
utinit.c	ACPICA: Support for iASL - multiple files and wildcards	2008-04-22 14:29:23 -04:00
utmath.c
utmisc.c	ACPICA: Lindent	2007-05-09 23:34:35 -04:00
utmutex.c	ACPICA: Lindent	2007-05-09 23:34:35 -04:00
utobject.c	ACPI: fix boot oops regression in thermal	2008-03-11 00:15:19 -04:00
utresrc.c	drivers/acpi/: Spelling fixes	2008-02-03 17:06:17 +02:00
utstate.c
utxface.c	ACPICA: Support for iASL - multiple files and wildcards	2008-04-22 14:29:23 -04:00